ZEISS DeepRecon
Faster 3D X-ray imaging throughput and superior imaging qualityfor advanced package analysis
ZEISS DeepRecon is the first commercially available deep learning reconstruction technology in the 3D X-ray imaging market.Intended for applications that repeatedly analyze the same or similar sample types, DeepRecon enables faster 3D X-ray scans while preserving ZEISS’s revolutionary Resolution at a Distance (RaaD) and image quality advantages.
Faster Throughput by up to 4X
Rapid structural and failure analysis (FA) aids fast product introductions and high customer satisfaction levels. Shrinking package interconnects, higher packing densities, and increasing package sizes result in smaller, more difficult-to-find defects and longer analysis times. DeepRecon enables faster high-resolution, high-quality 3D X-ray image acquisition for repetitive workflows used in process development and quality control. Up to 4X faster throughput is possible by leveraging deep learning networks customized per package type. The result is faster time to results and ability to increase sampling rates – allachieved without increasing the radiation dose to the sample.
Better Image Quality
High image contrast, high resolution, and high signal-to-noise ratios (SNR) are needed to produce the highest quality images for improved visualization of defects and small or low-contrast features. To achieve a high SNR using standard reconstruction techniques, higher exposure times and/or projections are generally required, which can significantly impact throughput. DeepRecon offers a statistically improved SNR, providing superior image quality. DeepRecon also reduces image artifacts that are typically inherent in faster imaging processes.
Customized, Optimal Performance
DeepRecon is a workstation-based option offered as a special customer solution forZEISS Xradia Versa X-ray microscopes (XRM) and Context microCT instruments. Network models are created per sample “class” and can be tailored to precisely fit targeted repetitive applications, enabling an ideal balance of image quality and throughput. Available for new or existing systems, the DeepRecon option uniquely opens opportunities in big data generated by 3D X-ray and provides significant AI-driven speed or image quality improvement.
DeepRecon is offered via the unique Advanced Reconstruction Toolbox for ZEISS Xradia 3D X-ray systems.
About ZEISS Xradia X-ray Imaging Solutions
ZEISS provides innovative X-ray hardware and software to meet the following challenges:
- Achieving the right ratio of resolution versus throughput (application and sample dependent)
- Achieving scan speeds as required for the full workflow (application and sample dependent)
- Visualizing submicron defects in large structures without the need for sample preparation and with a large FOV (i.e. to enable visualization of 100 nm diameter cracks within an intact 100 μm C4 bu mp)
- Visualizing defects and structures as interconnect pitch drops below 10 μm
- Mitigating beam hardening and other X-ray artifacts
- Minimizing dose (due to device radiation concerns)
ZEISS continuously develops new solutions to solve these challenges for semiconductor package analysis and FA applications. ZEISS offers unprecedented system extendibility with field conversion options and various u pgrades like DeepRecon to protect your investment.
ZEISS Process Control Solutions (PCS)Carl Zeiss SMT, Inc.4385 Hopyard RoadPleasanton, CA 94588USAwww.zeiss.com/pcs
ZEISS DeepRecon Faster 3D X-ray imaging throughput and superior Instruction Manual – ZEISS DeepRecon Faster 3D X-ray imaging throughput and superior Instruction Manual –
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